Why should the high and low temperature humidity test be conducted for the testing method of electronic components?

Date：2022-09-28 11:52:09Views：784

The application fields of electronic and electrical products are becoming wider and wider, and the environmental conditions they are subjected to are becoming more and more complex and diverse. Only when the environmental conditions of the products are reasonably specified and the environmental protection measures of the products are correctly selected, can the products be protected from damage during storage and transportation and be safe and reliable during use. In our natural environment, temperature and humidity are two inseparable natural factors. Different regions have different temperature and humidity effects due to different geographical locations. Therefore, the artificial simulation environment test of electronic and electrical products is to ensure their safety and reliability in production, transportation, use and other aspects.

The high and low temperature test is mainly aimed at the adaptability test of electrical and electronic products, their original components, and other materials when they are stored, transported, and used in the high and low temperature environment. The test equipment is mainly used to conduct environmental simulation test on the physical and other relevant characteristics of the product under low temperature, high temperature and conditions according to the national standard requirements or the user's own requirements. After the test, the performance of the product can still meet the predetermined requirements through testing, so as to provide for product design, improvement, identification and delivery inspection. Through high temperature aging, the hidden dangers in the production process such as the defects of components, welding and assembly can be exposed in advance. After aging, electrical parameter measurement can be carried out to screen out the components that have failed or changed values, so as to eliminate the early failure of the product before normal use as much as possible, so as to ensure that the ex factory products can withstand the test of time.

At present, electronic products are required to meet the requirements of humidity environment testing. Humidity testing is generally used to find out whether there are vulnerable parts and components in the design of the product as soon as possible, and whether there are problems or failure modes in the manufacturing process, so as to provide reference for improvement in product quality design. In order to ensure the performance of the product, various temperature and humidity indicators and time intervals will be used during the test. During the test, each stage must pass and meet the specification requirements.

Some materials that are easy to absorb moisture, such as printed circuit boards, plastic extrusions, packaging parts, etc., will absorb moisture in proportion to the pressure and time of exposure to water vapor. When materials absorb too much moisture, they will cause expansion or pollution and short circuit, and even damage the function of the product, such as causing leakage current between some sensitive circuits and causing product failure, Some chemical residues may even cause serious corrosion of circuit boards or metal surface oxidation due to water vapor. In some cases, the electronic migration effect caused by water vapor and voltage difference between adjacent lines may form dendritic filaments, which may lead to instability of the product system.

These tests are used to confirm the adaptability of the product to storage, transportation and use under temperature and humidity climatic conditions. The severity of the test depends on the high/low temperature, humidity and exposure duration. The quality problems of products caused by unreasonable design, raw materials or process measures during production and manufacturing are summarized as follows:

First, the performance parameters of the products do not meet the standards, and the products produced do not meet the use requirements; The second is potential defects. Such defects cannot be found by general testing methods, but need to be gradually exposed in the process of use, such as silicon chip surface pollution, tissue instability, welding holes, poor matching of chip and shell thermal resistance, etc.

The above is the relevant content of the "high and low temperature humidity test of electronic products" brought about by the core creation test. If our products have such problems, we must carry out various environmental tests to speed up the occurrence of these failure mechanisms, so as to understand the possible problems of the products. That's all for today's content. If you think the content is helpful, please pay attention to Chuangxin Testing, and we will provide you with more industry information!