Third party testing organization specialized in basic component testing

Date：2022-08-11 18:32:44Views：986

The reliability test of electronic components is the basis of the reliability of electronic equipment, and is also an integral part of electronic components and small electronic instruments and machines. It is often composed of several parts and can be used in similar products. It often refers to industrial parts such as electrical appliances, radios and instruments, such as capacitors and transistors. There are many kinds of products that need to be tested for reliability. Different enterprises have different requirements for testing. In the case of a large number of electronic components, how to test the components? Let's have a look.

There are three types of testing items for electronic components:

1. Routine test

Mainly test the appearance, size, electrical performance and safety performance of electronic components;

Test the basic parameters according to the specifications of components, such as triode, and test the appearance, size, Icbo, Vceo, Vces, HFE, pin tension, pin bending, solderability, welding heat resistance and other items. Some export products also need to test RoHS.

2. Reliability test

Mainly testing the life and environmental test of electronic components;

Test the service life of components and various environmental tests according to the user's requirements and specifications, such as high temperature test, low temperature test, moisture test, vibration test, large load test, high temperature durability test and other tests;

3. DPA analysis

It mainly controls the internal structure and process of the device.

For example, triodes are mainly used to detect the internal structure by X-ray, monitor the internal structure and packaging process by acoustic scanning, and monitor the internal wafer structure and size by opening. Among them, X-ray real-time imaging technology is widely used. Because of its non-destructive, easy-to-use and relatively low cost, it is favored by more and more electronic product manufacturers. X-ray detection can be used to check the internal state of components, such as chip arrangement, lead arrangement, lead frame design, solder balls (leads), etc. For components with complex structures, the angle, voltage, current of the X-ray tube, the contrast and brightness of the image can be adjusted to obtain effective image information.

Testing standards for electronic components:

1. Environmental test series standards for electrical and electronic products (GB / T 2423.1-2008);

2. Environmental test series standards for electrical and electronic products (IEC 60068);

3. Enclosure protection grade (GB / T 4208-2008);

4. General technical conditions for plastic packaging equipment of electronic components (GB t 13947-1992);

5. General specification for sockets and accessories for plug-in electronic components (GB t 15176-1994);

6. Atmospheric exposure test methods and guidelines for mechanical products and components in humid and hot environment (JB / T 7574-2013);

7. Test methods and guidelines for atmospheric exposure of mechanical products and components in cold environment (JB / T 7575-2013);

8. Atmospheric exposure test methods and guidelines for marine environment of mechanical products and components (JB / T 8683-2013);

9. Environmental test (SJ / T 11200-2016);

10. Power transformer (GB t 1094.1-2013).